Patent · US Active

In situ formed drain and source regions in a silicon/germanium containing transistor device

US8093634B2 · kind B2 · utility

7Cited by
0References
5Claims
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Key dates

Filing dateFeb 27, 2009
Grant dateJan 10, 2012
Priority date
Expiry dateNov 29, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/038

Abstract

By repeatedly applying a process sequence comprising an etch process and a selective epitaxial growth process during the formation of drain and source areas in a transistor device, highly complex dopant profiles may be generated on the basis of in situ doping. Further-more, a strain material may be provided while stress relaxation mechanisms may be reduced due to the absence of any implantation processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.