In situ formed drain and source regions in a silicon/germanium containing transistor device
US8093634B2 · kind B2 · utility
7Cited by
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5Claims
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Key dates
| Filing date | Feb 27, 2009 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
Abstract
By repeatedly applying a process sequence comprising an etch process and a selective epitaxial growth process during the formation of drain and source areas in a transistor device, highly complex dopant profiles may be generated on the basis of in situ doping. Further-more, a strain material may be provided while stress relaxation mechanisms may be reduced due to the absence of any implantation processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.