Patent · US Active

Semiconductor device

US8093711B2 · kind B2 · utility

20Cited by

7References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Zudock · Regensburg, DE
Thorsten Meyer · Regensburg, DE
Markus Brunnbauer · Lappersdorf, DE
Andreas Wolter · Regensburg, DE

Key dates

Filing date	Feb 2, 2009
Grant date	Jan 10, 2012
Priority date	—
Expiry date	Apr 3, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15331
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.