Nonplanar faceplate for a plasma processing chamber
US8097082B2 · kind B2 · utility
4Cited by
44References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2008 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T117/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for adjust local plasma density during a plasma process. One embodiment provides an electrode assembly comprising a conductive faceplate having a nonplanar surface. The nonplanar surface is configured to face a substrate during processing and the conductive faceplate is disposed so that the nonplanar surface is opposing a substrate support having an electrode. The conductive faceplate and the substrate support form a plasma volume. The nonplanar surface is configured to adjust electric field between the conductive plate and the electrode by varying a distance between the conductive plate and the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.