Process condition measuring device
US8104342B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2008 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Apr 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.