Temperature uniformity measurements during rapid thermal processing
US8104951B2 · kind B2 · utility
8Cited by
27References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 30, 2007 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Dec 27, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/48
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.