Electrolytic copper process using anion permeable barrier

US8123926B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Rajesh Baskaran · Dracut, US
• Robert W. Batz, Jr. · Kalispell, US
• Bioh Kim · Milford, US
• Tom Ritzdorf · Lolo, US
• John L. Klocke · Kalispell, US
• Kyle M. Hanson · Kalispell, US

Key dates

• Filing date: May 3, 2006
• Grant date: Feb 28, 2012
• Expiry date: Jul 14, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/423
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.