Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties
US8124522B1 · kind B1 · utility
26Cited by
49References
10Claims
0Family size
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Key dates
| Filing date | Apr 11, 2008 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Jan 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are methods of stabilizing an underlying dielectric diffusion barrier during deposition and ultraviolet (UV) processing of an overlying dielectric layer. Methods include modulating the optical properties reduces the effects of UV radiation on the dielectric diffusion barrier layer. The dielectric diffusion barrier can be made to absorb less UV radiation. A dielectric layer with UV absorbing properties may also be added on top of the diffusion barrier layer so less UV is transmitted. Both methods result in reduced interaction between UV radiation and the dielectric diffusion barrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.