Tom Mountsier
8Patents
6h-index
21Co-inventors
55Inventor score
Filing activity: Nov 21, 2001 → Mar 12, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8709948B2 | Tungsten barrier and seed for copper filled TSV | Electricity | 33 | Active |
| US7682966B1 | Multistep method of depositing metal seed layers | Electricity | 26 | Active |
| US8124522B1 | Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties | Electricity | 26 | Active |
| US8173537B1 | Methods for reducing UV and dielectric diffusion barrier interaction | Electricity | 25 | Active |
| US6720251B1 | Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing | Electricity | 8 | Expired |
| US7642202B1 | Methods of forming moisture barrier for low k film integration with anti-reflective layers | Electricity | 6 | Expired |
| US7052988B1 | Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing | Electricity | 3 | Expired |
| US8003549B1 | Methods of forming moisture barrier for low K film integration with anti-reflective layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.