Combinatorial plasma enhanced deposition techniques
US8129288B2 · kind B2 · utility
9Cited by
10References
29Claims
0Family size
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Key dates
| Filing date | Apr 30, 2009 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32366
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Combinatorial plasma enhanced deposition techniques are described, including designating multiple regions of a substrate, providing a precursor to at least a first region of the multiple regions, and providing a plasma to the first region to deposit a first material on the first region formed using the first precursor, wherein the first material is different from a second material formed on a second region of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.