Methods for discretized processing and process sequence integration of regions of a substrate
US8163631B2 · kind B2 · utility
11Cited by
3References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 27, 2011 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Sep 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/8593
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is processed by delivering materials to or modifying regions of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.