Particle reduction on surfaces of chemical vapor deposition processing apparatus
US8173228B2 · kind B2 · utility
120Cited by
42References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2006 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | May 29, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C3/322
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of reducing the amount of particulates generated from the surface of a processing component used during plasma enhanced chemical vapor deposition of thin films. The body of the processing component comprises an aluminum alloy, and an exterior surface of said processing component is texturized to increase the amount of surface area present on the exterior surface. The texturizing process includes at least one step in which the surface to be texturized is bead blasted or chemically grained, so that the surface roughness of the texturized surface ranges from about 50 μ-inch Ra to about 1,000 μ-inch Ra.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.