Patent · US Active

Bonding material with exothermically reactive heterostructures

US8177878B2 · kind B2 · utility

13Cited by

3References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Thorsten Scharf · Regensburg, DE
Edmund Riedl · Bergneustadt, DE
Steffan Jordan · Viehhausen, DE

Key dates

Filing date	Nov 30, 2009
Grant date	May 15, 2012
Priority date	—
Expiry date	Nov 30, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15747
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.