Patent · US Active

Semiconductor component and production method

US8178390B2 · kind B2 · utility

2Cited by

7References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Alfred Haimerl · Sinzing, DE
Michael Bauer · Nittendorf, DE
Angela Kessler · Regensburg, DE
Wolfgang Schober · Amberg, DE

Key dates

Filing date	Feb 20, 2006
Grant date	May 15, 2012
Priority date	—
Expiry date	Sep 25, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.