Patent · US Active

On-chip RF shields with front side redistribution lines

US8178953B2 · kind B2 · utility

17Cited by

28References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hans-Joachim Barth · Munich, DE
Thorsten Meyer · Regensburg, DE
Markus Brunnbauer · Lappersdorf, DE
Snezana Jenei · Munich, DE

Key dates

Filing date	Sep 30, 2008
Grant date	May 15, 2012
Priority date	—
Expiry date	Dec 13, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.