Integrated circuit packaging system with pad connection and method of manufacture thereof
US8193037B1 · kind B1 · utility
8Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2010 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a horizontal ridge at a lead top side; forming a connection layer having an inner pad and an outer pad directly on the lead top side, the inner pad having an inner pad bottom surface; mounting an integrated circuit over the inner pad; applying a molding compound, having a molding bottom surface, over the integrated circuit, the inner pad, and the outer pad; and applying a dielectric directly on the molding bottom surface and the inner pad bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.