Electro chemical deposition systems and methods of manufacturing using the same
US8197660B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
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Key dates
| Filing date | Sep 10, 2007 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | May 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electro chemical deposition system is described for forming a feature on a semiconductor wafer. The electro chemical deposition is performed by powering electrodes that includes a cathode, an anode and a plurality of electrically independent auxiliary electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.