Patent · US Active

Processing thin wafers

US8206551B2 · kind B2 · utility

1Cited by

21References

15Claims

0Family size

Assignee

INTEVAC, INC. · US

Inventors

Terry Bluck · Santa Clara, US
Stuart Scollay · San Jose, US
Edric Tong · Sunnyvale, US

Key dates

Filing date	Jun 16, 2009
Grant date	Jun 26, 2012
Priority date	—
Expiry date	Mar 24, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S414/141
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.