Wafer inspection data handling and defect review tool
US8209135B2 · kind B2 · utility
2Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2011 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Mar 4, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8861
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.