Patent · US Active

Cold temperature control in a semiconductor device

US8212184B2 · kind B2 · utility

9Cited by

5References

25Claims

0Family size

Assignee

GlobalFoundries Inc. · KY

Inventors

Anthony Mowry · Kyle, US
Casey Scott · Dresden, DE
Maciej Wiatr · Dresden, DE
Ralf Richter · Dresden, DE

Key dates

Filing date	Feb 23, 2009
Grant date	Jul 3, 2012
Priority date	—
Expiry date	Dec 15, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH10D89/60
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Operation of complex integrated circuits at low temperatures may be enhanced by providing active heating elements within the integrated circuit so as to raise the temperature of at least critical circuit portions at respective operational phases, such as upon power-up. Consequently, enhanced cold temperature performance may be obtained on the basis of existing process elements in order to provide design stability without requiring extensive circuit simulation or redesign of well-established circuit architectures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.