Plasma processing apparatus
US8216420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2006 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32302
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus for generating highly-uniform and stable plasma. In an apparatus for generating plasma by using a μ wave, concerning a method for rotating the μ wave in terms of time, a plurality of (larger than two and smaller than four) waveguides are used, then forming an angle between the respective waveguides, and setting a phase difference between respective electric fields therein. This configuration allows introduction of the circularly polarized wave into a processing chamber. At this time, there are provided configuration components such as a waveguide locating method, a unit therefor, a μ-wave merging box, and a reflective-wave control unit using a reflection control chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.