Electrophoretic solar cell metallization process and apparatus
US8216441B2 · kind B2 · utility
0Cited by
15References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2007 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the invention provide a novel apparatus and methods for forming a contact structure having metal lines formed using an electrophoretic deposition process. A substrate having a conductive or semiconductive layer is covered with an insulating layer and patterned to expose the conductive or semiconductive layer. The substrate is exposed to a processing medium comprising charged particles immersed in a dielectric fluid. An electric field is optionally applied. The charged particles deposit onto the exposed portions of the substrate and are then solidified in a reflow process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.