High-K metal gate electrode structures formed by separate removal of placeholder materials using a masking regime prior to gate patterning
US8232188B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2010 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Oct 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0177
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a replacement gate approach in sophisticated semiconductor devices, the place-holder material of gate electrode structures of different type are separately removed. Furthermore, electrode metal may be selectively formed in the resulting gate opening, thereby providing superior process conditions in adjusting a respective work function of gate electrode structures of different type. In one illustrative embodiment, the separate forming of gate openings in gate electrode structures of different type may be based on a mask material that is provided in a gate layer stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.