Method of joining a semiconductor device/chip to a printed wiring board
US8240031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2010 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | Jul 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4919
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.