Wafer carrier drive apparatus and method for operating the same
US8261905B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2010 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | May 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67709
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A drive rail includes a sealed interior cavity and an exterior drive surface that extends along a length of the drive rail. A first magnetic member is disposed within the interior cavity and adjacent to a surface of the interior cavity that is immediately opposite the exterior drive surface. A drive mechanism is disposed within the interior cavity and in connection with the first magnetic member, and is configured to move the first magnetic member within the interior cavity along the length of the drive rail, such that the first magnetic member remains immediately opposite the exterior drive surface. The first magnetic member is configured to magnetically couple through the exterior drive surface to a wafer carrier disposed adjacent to the exterior drive surface. Movement of the first magnetic member within the interior cavity along the drive rail causes corresponding movement of the wafer carrier along the exterior drive surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.