Method and apparatus for in-situ metrology of a workpiece disposed in a vacuum processing chamber
US8274645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2009 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Oct 1, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for in-situ metrology of a workpiece disposed in a vacuum processing chamber. The apparatus may include an optical assembly external to the processing chamber configured to focus a relatively large optical spot over a relatively large working distance to acquire a TE and TM spectra from a periodic array on the workpiece. The workpiece may be disposed in the processing chamber with an arbitrary orientation which is first determined via a reflectance measurement. TE and/or TM spectra may then be acquired by initiating a periodic triggering of a flash lamp based on the determined workpiece orientation to account for variation in placement of the workpiece within the processing chamber. The periodic array from which spectra are collected may be a memory array being fabricated in a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.