Plasma processing method
US8277563B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2011 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Feb 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67213
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a plasma processing method which includes (i) feeding a transferring gas which decreases a pressure difference between a processing chamber and a transfer chamber in order to prevent particles from adhering a processing sample, to be processed, passed to the processing chamber, before transferring the sample into the processing chamber; (ii) transferring the sample into the processing chamber while continuing to feed the transferring gas to the processing chamber; (iii) generating a plasma from the transferring gas in the processing chamber while continuing to feed the transferring gas to the processing chamber after the step of transferring the sample; and (iv) changing a gas supplied to the processing chamber from the transferring gas used in the step of generating the plasma to a processing gas for subjecting the processing sample, different from a cleaning sample, to plasma processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.