Methods and systems for determining a characteristic of a wafer
US8284394B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2007 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Aug 29, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/55
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.