Patent · US Active

Electrostatic post exposure bake apparatus and method

US8288174B1 · kind B1 · utility

12Cited by

12References

18Claims

0Family size

Assignee

TOKYO ELECTRON LIMITED · JP

Inventors

Benjamen M. Rathsack · Austin, US
Brian Head · Austin, US
Steven Scheer · Austin, US

Key dates

Filing date	Mar 24, 2011
Grant date	Oct 16, 2012
Priority date	—
Expiry date	Apr 20, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68742
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An Electrostatic Post Exposure Bake (EPEB) subsystem comprising an Electrostatic Bake Plate (EBP) configured in a processing chamber in an EPEB subsystem, wherein the EPEB wafer comprises an exposed masking layer having unexposed regions and exposed regions therein and the EPEB wafer is developed using the EBP.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.