Method for transferring chips onto a substrate
US8288250B2 · kind B2 · utility
6Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2009 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Jun 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a stack of at least two stages of circuits, each stage including a substrate and at least one component and metallic connections formed in or on this substrate, the assembly of a stage to be transferred onto a previous stage including: a) ionic implantation in the substrate of the stage to be transferred through at least part of the components, so as to form a weakened zone, b) formation of metallic connections of the components, c) transfer and assembly of some of this substrate onto the previous stage, and d) a step to thin the transferred part of the substrate by fracture along the weakened zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.