Semiconductor device comprising a metal gate stack of reduced height and method of forming the same
US8293610B2 · kind B2 · utility
2Cited by
7References
18Claims
0Family size
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Key dates
| Filing date | Sep 4, 2008 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Sep 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/691
Abstract
By providing a CMP stop layer in a metal gate stack, the initial height thereof may be efficiently reduced after the definition of the deep drain and source areas, thereby providing enhanced process conditions for forming highly stressed dielectric materials. Consequently, the dielectric material may be positioned more closely to the channel region substantially without deteriorating gate conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.