Patrick Press
15Patents
4h-index
23Co-inventors
56Inventor score
Filing activity: Aug 30, 2001 → Jul 16, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7741167B2 | Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain | Electricity | 18 | Active |
| US8791509B2 | Multiple gate transistor having homogenously silicided fin end portions | Electricity | 17 | Active |
| US8247281B2 | Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers | Electricity | 9 | Active |
| US7799682B2 | Transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor | Electricity | 7 | Active |
| US6548378B1 | Method of boron doping wafers using a vertical oven system | Chemistry; Metallurgy | 3 | Expired |
| US7605045B2 | Field effect transistors and methods for fabricating the same | Electricity | 3 | Active |
| US8039335B2 | Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain | Electricity | 2 | Active |
| US7893503B2 | Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain | Electricity | 2 | Active |
| US8293610B2 | Semiconductor device comprising a metal gate stack of reduced height and method of forming the same | Electricity | 2 | Active |
| US7745334B2 | Technique for locally adapting transistor characteristics by using advanced laser/flash anneal techniques | Electricity | 2 | Active |
| US7754554B2 | Methods for fabricating low contact resistance CMOS circuits | Electricity | 1 | Active |
| US8357575B2 | Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers | Electricity | 0 | Active |
| US7384877B2 | Technique for reducing silicide defects by reducing deleterious effects of particle bombardment prior to silicidation | Electricity | 0 | Expired |
| US7833874B2 | Technique for forming an isolation trench as a stress source for strain engineering | Electricity | 0 | Active |
| US8188871B2 | Drive current adjustment for transistors by local gate engineering | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.