Method and apparatus for reducing substrate edge effect during inspection
US8294094B1 · kind B1 · utility
4Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2011 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Aug 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method are introduced in this invention to reduce the edge effect of a substrate that causes image variation or distortion due to applied substrate bias. An edge plate with an edge effect eliminator are provided such that substrate is inspected by a charged particle beam can capture images without distortion at substrate edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.