Integrated circuit socket
US8297986B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2007 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Mar 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.