Apparatus and methods for transporting and processing substrates
US8303764B2 · kind B2 · utility
12Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2011 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Mar 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.