Coating method
US8304018B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2010 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Feb 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a coating method which can efficiently apply a coating liquid, such as a liquid resist, to the entire surface of a wafer even when the coating liquid is supplied in a smaller amount than a conventional one, and can therefore reduce the consumption of the coating liquid. The coating method includes: a first step of rotating the substrate at a first rotating speed while supplying the coating liquid onto approximately the center of the rotating substrate; a second step of rotating the substrate at a second rotating speed which is lower than the first rotating speed; a third step of rotating the substrate at a third rotating speed which is higher than the second rotating speed; and a fourth step of rotating the substrate at a fourth rotating speed which is higher than the second rotating speed and lower than the third rotating speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.