Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
US8309397B2 · kind B2 · utility
22Cited by
237References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2011 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Sep 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.