Patent · US Active

Structure for electrostatic discharge in embedded wafer level packages

US8309454B2 · kind B2 · utility

8Cited by

5References

14Claims

0Family size

Assignee

Intel Mobile Communications GmbH · DE

Inventors

Markus Brunnbauer · Lappersdorf, DE
Thorsten Meyer · Regensburg, DE
Stephan Bradl · Regensburg, DE
Ralf Plieninger · Poing, DE
Jens Pohl · San Luis Obispo, US
Klaus Pressel · Regensburg, DE
Recai Sezi · Simmerath, DE

Key dates

Filing date	May 10, 2007
Grant date	Nov 13, 2012
Priority date	—
Expiry date	Sep 16, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.