Radiant anneal throughput optimization and thermal history minimization by interlacing
US8319149B2 · kind B2 · utility
2Cited by
13References
6Claims
0Family size
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Key dates
| Filing date | Sep 29, 2008 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | May 13, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The time between illumination of adjacent zones of a workpiece edge is extended by a long cool-down period or delay, by interlacing a radiation beam scanning pattern. During the cool-down period, the beam successively scans (along the fast axis) two rows separated by about half the wafer diameter, and travels back and then forth (along the slow axis) across the distance between the two rows, while the radiation beam source continuously generates the beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.