Inventor · Singapore, SG

Kai Ma

21Patents
8h-index
33Co-inventors
71Inventor score

Filing activity: May 17, 2005 → Aug 25, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7323401B2 Semiconductor substrate process using a low temperature deposited carbon-containing hard mask Emerging Cross-Sectional Technologies 541 Expired
US7312162B2 Low temperature plasma deposition process for carbon layer deposition Electricity 523 Expired
US7109098B1 Semiconductor junction formation process including low temperature plasma deposition of an optical absorption layer and high speed optical annealing Electricity 521 Expired
US7429532B2 Semiconductor substrate process using an optically writable carbon-containing mask Electricity 517 Active
US7422775B2 Process for low temperature plasma deposition of an optical absorption layer and high speed optical annealing Electricity 514 Expired
US7312148B2 Copper barrier reflow process employing high speed optical annealing Electricity 513 Active
US7335611B2 Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer Performing Operations; Transporting 512 Active
US9288225B1 Server port sharing based on shared socket Electricity 8 Active
US8043981B2 Dual frequency low temperature oxidation of a semiconductor device Electricity 4 Active
US8309475B2 Apparatus and method of aligning and positioning a cold substrate on a hot surface Electricity 2 Active
US8319149B2 Radiant anneal throughput optimization and thermal history minimization by interlacing Performing Operations; Transporting 2 Active
US9337157B2 Miniature passive structures for ESD protection and input and output matching Electricity 2 Active
US8097543B2 Apparatus and method of aligning and positioning a cold substrate on a hot surface Electricity 1 Active
US9130511B2 Power amplifier and linearization techniques using active and passive devices Electricity 1 Active
US9154104B2 Miniaturized passive low pass filter Electricity 0 Active
US10879177B2 PVD deposition and anneal of multi-layer metal-dielectric film Chemistry; Metallurgy 0 Active
US9496253B2 Miniature passive structures, high frequency electrostatic discharge protection networks, and high frequency electrostatic discharge protection schemes Electricity 0 Active
US9431237B2 Post treatment methods for oxide layers on semiconductor devices Electricity 0 Active
US9373876B2 Multiple-mode filter for radio frequency integrated circuits Electricity 0 Active
US12033964B2 Chemical mechanical polishing for copper dishing control Electricity 0 Active
US9331659B2 Integrated circuit architecture with strongly coupled LC tanks Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.