James J. Murphy
26Patents
10h-index
50Co-inventors
78Inventor score
Filing activity: May 23, 1989 → Aug 16, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8143124B2 | Methods of making power semiconductor devices with thick bottom oxide layer | Emerging Cross-Sectional Technologies | 132 | Active |
| US5478435A | Point of use slurry dispensing system | Performing Operations; Transporting | 113 | Expired |
| US7078296B2 | Self-aligned trench MOSFETs and methods for making the same | Electricity | 53 | Expired |
| US6444528B1 | Selective oxide deposition in the bottom of a trench | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6437386B1 | Method for creating thick oxide on the bottom surface of a trench structure in silicon | Electricity | 37 | Expired |
| USD343916S | Headlamp with hexagonal faceted reflector | General | 26 | Expired |
| US7936009B2 | Shielded gate trench FET with an inter-electrode dielectric having a low-k dielectric therein | Electricity | 23 | Active |
| US6861296B2 | Method for creating thick oxide on the bottom surface of a trench structure in silicon | Electricity | 17 | Expired |
| US8329538B2 | Shielded gate trench FET with an inter-electrode dielectric having a low-k dielectric therein | Electricity | 15 | Active |
| US5055343A | Patterned metallized film and method for making same | Emerging Cross-Sectional Technologies | 12 | Expired |
| US8058732B2 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Electricity | 7 | Active |
| US7768075B2 | Semiconductor die packages using thin dies and metal substrates | Electricity | 6 | Expired |
| US7960800B2 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Electricity | 4 | Active |
| US8936985B2 | Methods related to power semiconductor devices with thick bottom oxide layers | Emerging Cross-Sectional Technologies | 3 | Active |
| US8198196B1 | High aspect ratio trench structures with void-free fill material | Electricity | 3 | Active |
| US8598035B2 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Electricity | 3 | Active |
| US8343852B2 | Method and structure for dividing a substrate into individual devices | Electricity | 2 | Active |
| US8158506B2 | Methods and designs for localized wafer thinning | Electricity | 2 | Active |
| US8143125B2 | Structure and method for forming a salicide on the gate electrode of a trench-gate FET | Electricity | 1 | Active |
| US7951688B2 | Method and structure for dividing a substrate into individual devices | Electricity | 1 | Active |
| US8129778B2 | Semiconductor devices and methods for making the same | Electricity | 1 | Active |
| US7956411B2 | High aspect ratio trench structures with void-free fill material | Electricity | 1 | Active |
| US8329508B2 | Semiconductor die packages using thin dies and metal substrates | Electricity | 1 | Active |
| US9637714B2 | Diffuse light extended surface area water-supported photobioreactor | Emerging Cross-Sectional Technologies | 1 | Active |
| US11472118B2 | System and method of manufacturing a mouth piece | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.