Patent · US Active

Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same

US8330245B2 · kind B2 · utility

18Cited by

13References

46Claims

0Family size

Assignee

MEMC Electronic Materials, Inc. · US

Inventors

John A. Pitney · Saint Peters, US
Ichiro Yoshimura · Yokohama, JP
Lu Fei · Shanghai, CN

Key dates

Filing date	Feb 4, 2011
Grant date	Dec 11, 2012
Priority date	—
Expiry date	Feb 4, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/02052
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The disclosure relates to preparation of silicon on insulator structures with reduced unbonded regions and to methods for producing such wafers by minimizing the roll-off amount (ROA) of the handle and donor wafers. Methods for polishing wafers are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.