Patent · US Active

Stacked-die package for battery power management

US8344519B2 · kind B2 · utility

9Cited by

33References

5Claims

0Family size

Assignee

Alpha and Omega Semiconductor, Ltd. · US

Inventors

Jun Lu · San Jose, US
Allen Timothy Chang · Hsinchu, TW
Xiaotian Zhang · San Jose, US

Key dates

Filing date	Apr 18, 2011
Grant date	Jan 1, 2013
Priority date	—
Expiry date	Apr 18, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A battery protection package assembly is disclosed. The assembly includes a power control integrated circuit (IC) with pins for a supply voltage input (VCC) and a ground (VSS) on a first side of the power control IC. First and second common-drain metal oxide semiconductor field effect transistors (MOSFETs) are electrically coupled to the power control IC. The power control IC and the first and second common-drain metal oxide semiconductor field effect transistors (MOSFET) are co-packaged on a common die pad. The power control IC is vertically stacked on top of one or more of the first and second common-drain MOSFETs. Leads coupled to a supply voltage input (VCC) and a ground (VSS) of the power control IC are on a first side of the common die pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.