Xiaotian Zhang
51Patents
8h-index
70Co-inventors
77Inventor score
Filing activity: Jun 10, 2005 → Jul 15, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7868431B2 | Compact power semiconductor package and method with stacked inductor and integrated circuit die | Electricity | 59 | Active |
| US7884696B2 | Lead frame-based discrete power inductor | Electricity | 37 | Active |
| US8581376B2 | Stacked dual chip package and method of fabrication | Electricity | 16 | Active |
| US7898092B2 | Stacked-die package for battery power management | Electricity | 13 | Active |
| US8952509B1 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Electricity | 11 | Active |
| US7612439B2 | Semiconductor package having improved thermal performance | Electricity | 10 | Active |
| US8344519B2 | Stacked-die package for battery power management | Electricity | 9 | Active |
| US8217748B2 | Compact inductive power electronics package | Emerging Cross-Sectional Technologies | 9 | Active |
| US7511361B2 | DFN semiconductor package having reduced electrical resistance | Electricity | 7 | Expired |
| US8150982B2 | Method, system for accessing home network device and home network access device | Electricity | 7 | Active |
| US7884454B2 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Electricity | 6 | Active |
| US7759775B2 | High current semiconductor power device SOIC package | Electricity | 5 | Active |
| US8669650B2 | Flip chip semiconductor device | Electricity | 4 | Active |
| USD1024139S1 | Lawn mower blade | General | 3 | Active |
| US9478646B2 | Methods for fabricating anode shorted field stop insulated gate bipolar transistor | Electricity | 3 | Active |
| US9006870B2 | Stacked multi-chip packaging structure and manufacturing method thereof | Electricity | 3 | Active |
| US7781265B2 | DFN semiconductor package having reduced electrical resistance | Electricity | 3 | Active |
| US8455303B2 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Electricity | 3 | Active |
| USD1036509S1 | Lawn mower head | General | 2 | Active |
| US8484318B2 | Method, apparatus and system for upgrading through multicast | Electricity | 2 | Active |
| US10924118B1 | Positive feedback XOR/XNOR gate and low-delay hybrid logic adder | Emerging Cross-Sectional Technologies | 2 | Active |
| US7884452B2 | Semiconductor power device package having a lead frame-based integrated inductor | Electricity | 2 | Active |
| US10630080B1 | Super-fast transient response (STR) AC/DC Converter for high power density charging application | Electricity | 2 | Active |
| US9337132B2 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Electricity | 2 | Active |
| US11165053B2 | Conductive-flake strengthened, polymer stabilized electrode composition and method of preparing | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.