Method of fabricating a two-sided die in a four-sided leadframe based package
US8349655B2 · kind B2 · utility
0Cited by
6References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 21, 2010 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | May 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. In embodiments, a semiconductor die having die bond pads along two adjacent edges may be electrically coupled to four sides of a four-sided leadframe. Embodiments relate to lead and no-lead type leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.