Fused buss for plating features on a semiconductor die
US8349666B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2011 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Jul 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a semiconductor structure includes forming a plurality of fuses over a semiconductor substrate; forming a plurality of interconnect layers over the semiconductor substrate and a plurality of interconnect pads at a top surface of the plurality of interconnect layers; and forming a seal ring, wherein the seal ring surrounds active circuitry formed in and on the semiconductor substrate, the plurality of interconnect pads, and the plurality of fuses, wherein each fuse of the plurality of fuses is electrically connected to a corresponding interconnect pad of the plurality of interconnect pads and the seal ring, and wherein when each fuse of the plurality of fuses is in a conductive state, the fuse electrically connects the corresponding interconnect pad to the seal ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.