Integrated circuit package on package system
US8367465B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2006 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Sep 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.