Temperature monitoring in a semiconductor device by thermocouples distributed in the contact structure

US8373244B2 · kind B2 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Anthony Mowry · Kyle, US
• Casey Scott · Dresden, DE
• Roman Boschke · Dresden, DE

Key dates

• Filing date: Jul 8, 2008
• Grant date: Feb 12, 2013
• Expiry date: Jan 12, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N19/00
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

By forming thermocouples in a contact structure of a semiconductor device, respective extension lines of the thermocouples may be routed to any desired location within the die, without consuming valuable semiconductor area in the device layer. Thus, an appropriate network of measurement points of interest may be provided, while at the same time allowing the application of well-established process techniques and materials. Hence, temperature-dependent signals may be obtained from hot spots substantially without being affected by design constraints in the device layer.