Electroplating cup assembly

US8377268B2 · kind B2 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Robert Rash · Portland, US
• Shantinath Ghongadi · Tigard, US
• Kousik Ganesan · Tualatin, US
• Zhian He · Beaverton, US
• Tariq Majid · Wilsonville, US
• Jeff Hawkins · Portland, US
• Seshasayee Varadarajan · Lake Oswego, US
• Bryan L. Buckalew · Tualatin, US

Key dates

• Filing date: Jun 6, 2011
• Grant date: Feb 19, 2013
• Expiry date: Jun 6, 2031

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D7/123
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.