Polishing pad with controlled void formation
US8377351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Oct 2, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249978
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.