Patent · US Active

Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method

US8382558B2 · kind B2 · utility

9Cited by

10References

10Claims

0Family size

Assignee

EBARA CORPORATION · JP

Inventors

Katsuhide Watanabe · Tokyo, JP
Ryuichi Kosuge · Tokyo, JP
Soichi Isobe · Yokohama, JP

Key dates

Filing date	Jan 20, 2010
Grant date	Feb 26, 2013
Priority date	—
Expiry date	Feb 7, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B53/017
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus dresses a polishing pad. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the dresser flange and configured to allow the dressing member to tilt with respect to the dresser drive shaft, and a spring mechanism configured to generate a force against a tilting motion of the dressing member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.